Diffusion in Copper-rich Copper-Silicon Alloys

Electronic structure of copper-rich copper-gold alloys.

We present and discuss angle-resolved photoemission measurements from the (111) and (100) faces of CuAu single crystals containing 10 at. %%u oA u in th ebul k, togethe rwit hcomputation sof complex-energy bands and densities of states in the Cu90Aulo random alloy. Our calculations permit (.' a good understanding of the shifts and smearings in t e spectrum of Cu arising from the addition of Au ...

Soldering and brazing of copper and copper alloys

Wettability of Brazing Filler Metals on Copper and Copper Alloys

The possibility of alloying can not be avoided at the interface between molten brazing filler metal and base metal in brazing, so the wettability of brazing filler metal can not be easily explained theoretically. We used the original apparatus for wettability test and investigated the relation between the wettability of brazing filler metals of Ag-P-Cu and Ag-Cu-Zn-Cd systems on copper and the ...

Inhibition Mechanisms of Organic Compounds on Copper and Copper Alloys

Copper and Nickel Alloys Clad with Platinum and Its Alloys THE IMPORTANT INFLUENCE OF DIFFUSION

Cladding base metals with platinum or platinum alloys offers certain technical and economic advantages. In an earlier paper the mechanical properties of the metals to be joined were discussed. In this second paper it is shown that interdifi ion of the two materials being joined together must be considered, and that ifthe partners have different diffusion coefficients diffzculties can result dur...